FUTUR-IC will present on the first day of the IPSR-International’s Spring 2025 Meeting, with the 9-5am session focusing on our semiconductor value chain innovation work.
The FUTUR-IC will give the following keynotes:
- Keynote Session I: Hardware, Software and Architecture Convergence
- Roadblocks and Solutions for Materials, Tools, and Processes; Comprehensive LCA accounting
- Keynote Session II: Keynote Session II: Connectivity Requirements for AI Architectures
- [Energy x Delay] Scaling for Data Centers and HPC: GPUs, Connections and Communications
- Keynote Session III: Electronic-Photonic Package Level Integration
- Solutions for Scaling Bandwidth Density, Energy and Cost: CPO, Connectors and Interfaces
- Keynote Session IV: Packaging and Assembly: Polymer Technology Drivers
- iNEMI Working Group Presentations and Panel Discussion
All are welcome to join a networking reception after the keynotes.
Location
MIT, Room 6-120, Cambridge MA